Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-12-20
2005-12-20
Schillinger, Laura M. (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
06977215
ABSTRACT:
Disclosed herein is a method of making integrated circuits. In one embodiment the method includes forming tungsten plugs in a integrated circuit and forming electrically conductive interconnect lines after formation of the tungsten plugs, wherein at least one tungsten plug is electrically connected to at least one electrically conductive interconnect line. Separate from the formation of the tungsten plugs and electrically conductive interconnect lines, a gas is introduced into a liquid. At least one electrically conductive interconnect line is then contacted with the gas introduced liquid.
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Dauch Elizabeth A.
Jacobs John W.
Campbell Stephenson Ascolese LLP
Dolan Jennifer M
NEC Electronics America, Inc.
Schillinger Laura M.
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