Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2006-06-13
2006-06-13
Nguyen, Ha (Department: 2812)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S778000, C534S011000, C534S015000
Reexamination Certificate
active
07060636
ABSTRACT:
The present invention is directed toward a tunable dielectric device comprising: a substrate and an endohedral fullerene encapsulating trimetallic nitride template compound disposed on the substrate. The endohedral fullerene encapsulating trimetallic nitride template compound has a dipole moment that is oriented when a voltage of less than about 5 volts is applied thereto causing a change in the orientation of the dipole moment of the compound. The physical dimension of the compound is essentially unchanged.
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Koene Bryan E.
Phillips Janice P.
Rogers Martin E.
Stevenson Steven A.
Topasna Daniela M.
Bryant Joy L.
Lee Kyoung
Luna Innovations Incorporated
Nguyen Ha
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