Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2006-03-21
2006-03-21
Siek, Vuthe (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C716S030000, C716S030000, C716S030000
Reexamination Certificate
active
07017139
ABSTRACT:
A system for minimizing the length of the longest diagonal interconnection. A multiple chip module may comprise a first chip connected to a second chip located diagonally to the first chip. The first and second chip are interconnected by one or more interconnections commonly referred to as diagonal interconnections. Since the one or more diagonal interconnections between the first chip and the second chip are interconnected between a set of pins on each chip that form a triangular pattern, the longest diagonal interconnection is substantially the same length as the length of the longest orthogonal interconnection. Furthermore, since the one or more diagonal interconnections between the first chip and the second chip are interconnected between a set of pins on each chip that form a triangular pattern, the longest diagonal interconnection is substantially the same length as the length of the second longest diagonal interconnection.
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International Business Machines - Corporation
Salys Casimer K.
Siek Vuthe
Voigt, Jr. Robert A.
Winstead Sechrest & Minick P.C.
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