Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Self-aligned
Reexamination Certificate
2006-11-28
2006-11-28
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
Self-aligned
C438S258000
Reexamination Certificate
active
07141480
ABSTRACT:
The present invention provides a tri-gate lower power device and method for fabricating that tri-gate semiconductor device. The tri-gate device includes a first gate [455]located over a high voltage gate dielectric [465]within a high voltage region [460], a second gate [435]located over a low voltage gate dielectric [445]within a low voltage core region [440]and a third gate [475]located over an intermediate core oxide [485]within an intermediate core region [480]. One method of fabrication includes forming a high voltage gate dielectric layer [465]over a semiconductor substrate [415], implanting a low dose of nitrogen [415a] into the semiconductor substrate [415]in a low voltage core region [440], and forming a core gate dielectric layer [445]over the low voltage core region [440], including forming an intermediate core gate dielectric layer [485]over an intermediate core region [480].
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Adam Lahir Shaik
Breashears Eddie H.
Tsao Alwin J.
Brady W. James
Dang Phuc T.
Keagy Rose Alyssa
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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