Trench planarization techniques

Details Trench planarization techniques Trench planarization techniques

1991-06-06

1994-03-01

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156645, 156649, 156657, 437 67, 437228, H01L 2100

Patent

active

052903966

ABSTRACT:
Various techniques for quantifying polishing performance are disclosed, and provide insight on the progression from a planarization regime to a smoothing regime to a blanket polish back regime, as well as providing a single, definable parameter (Quality Characteristic) for optimizing polishing performance. With these analytical tools in hand, it is possible to create novel structures which absorb polish rate non-uniformities across a wafer, and it is also possible to define and employ a "quick" polish step to clear high spots which will be followed by a subsequent etch step for rapid removal of material.

REFERENCES:
patent: 4019248 (1977-04-01), Black
patent: 4473598 (1984-09-01), Ephrath et al.
patent: 4490209 (1984-12-01), Hartman
patent: 4493142 (1985-01-01), Hwang
patent: 4609809 (1986-09-01), Yamaguchi et al.
patent: 4758306 (1988-07-01), Cronin et al.
patent: 4851097 (1989-07-01), Hattori et al.
patent: 4876217 (1989-10-01), Zdebel
patent: 4948742 (1990-08-01), Nishimura et al.
patent: 4980019 (1990-12-01), Baerg et al.
patent: 4980311 (1990-12-01), Namose
patent: 5006482 (1991-04-01), Kerbaugh et al.
patent: 5011788 (1991-04-01), Kawaji et al.
patent: 5015602 (1991-05-01), Van Der Plas et al.
patent: 5091289 (1992-02-01), Cronin et al.
patent: 5091330 (1992-02-01), Cambou et al.
patent: 5102822 (1992-04-01), Calligaro
patent: 5104482 (1992-04-01), Monkowski et al.
patent: 5142828 (1992-09-01), Curry, II
Thin Film Processes, by Vossen et al, pp. 497-521, 1978.

Affiliated with

Also associated with

Rating

Trench planarization techniques does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Trench planarization techniques, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Trench planarization techniques will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-573904