Trench MOSFET with multi-resistivity drain to provide low on-res

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257331, 257341, H01L 2976, H01L 2994, H01L 31062

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active

058959521

ABSTRACT:
A MOSFET switch with a gate formed in a trench has a drain which includes a region of relatively high resistivity adjacent the trench and a region of relatively low resistivity further away from the trench. The drain may also include a "delta" layer having even lower resistivity in a central region of the MOSFET cell. The high resistivity region limits the strength of the electric field at the edge of the trench (particularly where there are any sharp corners) and thereby avoids damage to the gate oxide layer. The central "delta" layer helps to insure that any breakdown will occur near the center of the MOSFET cell, away from the gate oxide, and to lower the resistance of the MOSFET when it is in an on condition.

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Shenai, K: "Optimized Trench Mosfet...."; Transactions on Electron Devices; Jun. 1992.
Shenai, K.: "Optimized Trench MOSFET Technologies for Power Devices", IEEE Transactions on Electron Devices, Jun. 1992, USA, vol. 39, No. 6, pp. 1435-1443, ISSN 0018-9383 XP000271790.

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