Trench MOSFET with cell layout, ruggedness, truncated corners

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S330000, C257S331000, C257S372000, C257SE29257, C257SE21549

Reexamination Certificate

active

07812409

ABSTRACT:
A trenched semiconductor power device that includes a trenched gate disposed in an extended continuous trench surrounding a plurality of transistor cells wherein the layout of the trenched gate surrounding the transistor cells as closed cells having truncated corners or rounded corners. In an exemplary embodiment, the closed cells further includes a contact metal to contact a source and a body regions wherein the contact metal the trenched gate surrounding the transistor cell have a uniform space between them. In another exemplary embodiment, the semiconductor power device further includes a contact dopant region disposed below the contact metal to enhance an electrical contact between the metal contact and the source region and the body region, and the contact dopant region having substantially circular shape to achieve a uniform space between the contact dopant region and the trenched gate surrounding the closed cells.

REFERENCES:
patent: 6031265 (2000-02-01), Hshieh
patent: 6107661 (2000-08-01), Okabe et al.
patent: 6288454 (2001-09-01), Allman et al.
patent: 6320223 (2001-11-01), Hueting et al.
patent: 6541818 (2003-04-01), Pfirsch et al.
patent: 6621107 (2003-09-01), Blanchard et al.
patent: 6867083 (2005-03-01), Imam et al.
patent: 6936890 (2005-08-01), Hueting et al.
patent: 6949432 (2005-09-01), Blanchard
patent: 7439583 (2008-10-01), Hshieh
patent: 2001/0031551 (2001-10-01), Hshieh et al.
patent: 2006/0202264 (2006-09-01), Bhalla et al.

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