Trench MOSFET with an ONO insulating layer sandwiched...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S173000, C257S283000, C257S284000, C257S328000, C257S330000, C257S332000, C257S333000, C257SE27016, C257SE29015

Reexamination Certificate

active

07728385

ABSTRACT:
A device structure is disclosed for preventing gate oxide damage of a trench MOSFET during wafer processing while adding an ESD protection module atop the trench MOSFET. The ESD protection module has a low temperature oxide (LTO) bottom layer whose patterning process was found to cause the gate oxide damage before. The present invention structure includes a semiconductor substrate having an active area and a termination area; numerous trench MOSFET cells disposed in the active area; numerous electrostatic discharge (ESD) diodes disposed above the semiconductor substrate in the termination area; and an insulation layer comprising Oxide/Nitride/Oxide (ONO) sandwiched between the ESD diodes and the semiconductor substrate. In one embodiment, the active area does not contain the ONO insulation layer.

REFERENCES:
patent: 2008/0042208 (2008-02-01), Hshieh

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