Trench liner for DSO integration

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S198000, C438S222000, C257SE21642

Reexamination Certificate

active

07544548

ABSTRACT:
A semiconductor process and apparatus provide a shallow trench isolation region (96) with a trench liner (95, 104) for use in a hybrid substrate device (21) by lining a first trench with a first trench liner (95), and then lining a second trench formed within the first trench by depositing a second trench liner (104) that is anisotropically etched to expose an underlying substrate (70) on which is epitaxially grown a silicon layer (110) to fill the second trench. By forming first gate electrodes (251) over a first SOI substrate (90) using deposited (100) silicon and forming second gate electrodes (261) over an epitaxially grown (110) silicon substrate (110), a high performance CMOS device is obtained which includes high-k metal PMOS gate electrodes (261) having improved hole mobility.

REFERENCES:
patent: 6815278 (2004-11-01), Ieong et al.
patent: 7125785 (2006-10-01), Cohen et al.
patent: 2005/0090072 (2005-04-01), Doris et al.
patent: 2005/0142799 (2005-06-01), Seo
M. Yang et al., “High Performance CMOS Fabricated on Hybrid Substrate with Different Crystal Orientations,” IEEE, IEDM 2003, pp. 453-456.
B. Doris et al., A Simplified Hybrid Orientation Technology (SHOT) for High Performance CMOS, VLSI Technology, Digest of Technical Papers, 2004 Symposium, pp. 86-87.

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