Trench filling method employing oxygen densified gap filling sil

Details Trench filling method employing oxygen densified gap filling sil Trench filling method employing oxygen densified gap filling sil

1997-03-03

1998-10-06

Fourson, George R.

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Grooved and refilled with deposited dielectric material

427 99, 438790, H01L 2176

Patent

active

058175660

ABSTRACT:
A method for filling a trench within a substrate. There is first providing a substrate having a trench formed within the substrate. There is then formed over the substrate and within the trench a gap filling silicon oxide trench fill layer. The gap filling silicon oxide trench fill layer is formed through an ozone assisted sub-atmospheric pressure thermal chemical vapor deposition (SACVD) method. The method employs an ozone oxidant and a tetra-ethyl-ortho-silicate (TEOS) silicon source material at an ozone: TEOS volume ratio of less than about 2:1. Finally, the substrate is annealed thermally within an oxygen containing atmosphere at a temperature of greater than about 1100 degrees centigrade to form from the gap filling silicon oxide trench fill layer a densified gap filling silicon oxide trench fill layer. Through the method there is formed a densified gap filling silicon oxide trench fill layer with a limited surface sensitivity, a low etch rate and a limited shrinkage. Through an analogous method employing an ozone oxidant and a tetra-ethyl-orth-silicate (TEOS) silicon source material at an ozone: TEOS volume ratio of from about 10:1 to about 14:1 there may be formed a densified gap filling silicon oxide layer with exceedingly low shrinkage.

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