Trench capacitor structure

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S303000, C257S309000, C257S302000, C257S296000, C257S300000, C257S304000, C257S305000, C438S242000, C438S243000, C438S426000, C438S388000

Reexamination Certificate

active

06989561

ABSTRACT:
Afin-type trench capacitor structure includes a buried plate diffused into a silicon substrate. The buried plate, which surrounds a bottle-shaped lower portion of the trench capacitor structure, is electrically connected to an upwardly extending annular poly electrode, thereby enabling the buried plate and the annular poly electrode to constitute a large-area capacitor electrode of the trench capacitor structure. A capacitor storage node consisting of a surrounding conductive layer, a central conductive layer and a collar conductive layer encompasses the upwardly extending annular poly electrode. A first capacitor dielectric layer isolates the capacitor storage node from the buried plate. A second capacitor dielectric layer and a third capacitor dielectric layer isolate the upwardly extending annular poly electrode from the capacitor storage node.

REFERENCES:
patent: 5365097 (1994-11-01), Kenney
patent: 6194755 (2001-02-01), Gambino et al.
patent: 6271079 (2001-08-01), Wei et al.
patent: 6319787 (2001-11-01), Enders et al.
patent: 6440813 (2002-08-01), Collins et al.
patent: 6448131 (2002-09-01), Cabral et al.

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