Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2008-05-20
2008-05-20
McDonald, Rodney G. (Department: 1795)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192150, C204S192160, C427S524000, C427S525000, C427S527000, C427S528000, C427S534000, C427S587000, C427S591000, C427S592000
Reexamination Certificate
active
11042150
ABSTRACT:
A continuous, uninterrupted two-step treatment process capable of forming nanometer scale physical structures on the surface of articles fabricated from metallic, ceramic, glass, or plastic materials, and then depositing a thin conformal coating on the nanostructured surface such that the physical structures previously produced are neither masked nor are the dimensions of the physical structures substantially altered. In an additional embodiment, a thicker coating can be grown from the thin conformal coating which itself can be nanostructured as it is deposited. In this case adhesion of the thicker coating is not dependent upon the use of conventional surface pretreatments such as machining, chemical etching, or abrasive blasting. Surface texturing may be performed by ion beam sputtering, and ion assisted coating forms the thin conformal coating, and thicker coating if desired. The treatment process is useful for improving the mechanical, catalytic, chemical, or biological activity of the surfaces so treated. The process thus has application on industrial machinery and equipment of all types, engines of all types, manufacturing tooling and wear parts of all types, and medical equipment and prostheses.
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Borel Robert J.
Deutchman Arnold H.
Partyka Robert J.
Baker & Hostetler LLP
McDonald Rodney G.
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