Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1987-05-12
1989-03-07
Michl, Paul R.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430296, 430271, 430942, 4284735, 428446, 428451, G03C 176
Patent
active
048106178
ABSTRACT:
An improved electron beam resist structure comprises an organic planarizing layer which has been treated with an ion beam for a time sufficient to render it conductive and an electron beam resist layer thereover. The electron beam resist layer is preferably oxygen plasma resistant. When the resist layer is not resistant to oxygen plasma and it is desired to develop the planarizing layer by oxygen plasma, the structure additionally includes a thin hard mask layer, suitably of silicon dioxide, interposed between the conductive planarizing layer and the resist layer.
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E. C. Fredericks, "Adhesion and Release Layer for Resist Structures", IBM Technical Disclosure Bulletin, vol. 20, No. 3, Aug. 1977, p. 992.
E. Ong and E. L. Hu, "Multilayer Resists for Fine Line Optical Lithography", Solid State Technology, Jun. 1984, pp. 155-160.
J. B. Kruger, P. Rissman and M. S. Chang, Journal of Vacuum Science Technology, vol. 19, No. 4, Nov., Dec., 1981, pp. 1320-1324.
Brown Richard
White Lawrence K.
Davis Jr. James C.
General Electric Company
Hamilton Cynthia
Michl Paul R.
Steckler Henry I.
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