Treatment method for plate-shaped substrate

Details Treatment method for plate-shaped substrate Treatment method for plate-shaped substrate

1987-01-15

1988-05-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 32, 134 34, 156643, 156646, 156653, 156657, 1566591, 156662, 156345, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

047463970

ABSTRACT:
A treatment method for plate-shaped substrate capable of uniformly performing the treating operation, performing a large amount of treatment, and facilitating the automation of the work independently of the surface nature of the substrate such as base plates of Si wafer for integrated circuit manufacturing use. The method is achieved by making it easier for the whole substrate surface to be wetted with the treatment liquid, through exposing the substrate to liquid or gas material which is soluble mutually with a treatment liquid prior to treatment with the treating liquid, to avoid treatment and thus uneven treatment to improve the yield.

REFERENCES:
patent: 3291640 (1966-12-01), Livingston
patent: 4448635 (1984-05-01), Kuiken et al.
patent: 4468283 (1984-08-01), Ahmed

Affiliated with

Also associated with

Rating

Treatment method for plate-shaped substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Treatment method for plate-shaped substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Treatment method for plate-shaped substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1056866