Traveling wave tube with plate for bonding thermally-mismatched

Electric lamp and discharge devices: systems – Cathode ray tube circuits – Combined cathode ray tube and circuit element structure

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315 393, 333 22R, H01J 2330

Patent

active

054020328

ABSTRACT:
A method for bonding thermally-mismatched elements of a traveling wave tube employs a metallic plate of undulating character. The plate is located at the region of the interface between tube elements formed of materials of materially-differing thermal character such as the ceramic termination piece and an adjacent sever pole piece of copper. Through either a brazing or a sintering process, pluralities of bonds are formed at points of tangency between the plate and the two elements of differing thermal expansion coefficients. As a result, a good heat flow path, accompanied by a more stable r.f. interface, is formed between the materials that is not subject to fracture as are prior art diffusion bonds.

REFERENCES:
patent: 3181023 (1965-04-01), Hant et al.
patent: 3717787 (1973-02-01), Doyle
patent: 4019087 (1977-04-01), Hamada et al.
patent: 4105911 (1978-08-01), King et al.
patent: 4147956 (1979-04-01), Horigome et al.
patent: 4455507 (1984-06-01), Greco et al.
patent: 4532190 (1985-07-01), Kanbe et al.
patent: 4711386 (1987-12-01), Mizuhara
patent: 4950558 (1990-08-01), Sarin

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