Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate
2006-09-05
2006-09-05
Ahmadi, Mohsen (Department: 2812)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
C427S164000, C427S178000, C427S204000, C427S219000, C428S336000, C428S216000, C428S469000, C428S472000, C359S359000, C359S580000
Reexamination Certificate
active
07101810
ABSTRACT:
Transparent articles comprising transparent, nonmetallic substrate and a transparent film stack is sputter deposited on the substrate. The film stack is characterized by including at least one infrared reflective metal film, a dielectric film over the metal film, and a protective silicon nitride film of 10 Å to 150 Å in thickness over the said dielectric film. The dielectric film desirably has substantially the same index of refraction as does silicon nitride and is contiguous with the silicon nitride film.
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Bond Robert
Hoffman Wayne L.
Stanek Roger P.
Ahmadi Mohsen
Cardinal CG Company
Fredrikson & Byron , P.A.
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