Transistor having an improved salicided gate and method of const

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

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Details

438302, 438303, 438308, 438798, 438800, 257309, 257401, 257388, H01L 213205, H01L 21336, H01L 21477

Patent

active

060487844

ABSTRACT:
A method of fabricating a transistor having an improved salicided gate is provided. The method may include forming a gate (14) that is separated from a substrate (12) by a gate insulator (16). A spacer (22) may be formed proximate the gate (14) such that the spacer (22) exposes a top region (28) and a side region (30) of the gate (14). The top region (28) and the side region (30) of the gate (14) may be irradiated at an angle (38) to form a post amorphous region (32) within the gate (14). A reactive layer (42) may be formed adjacent the post amorphous region (32). A salicidation region (44) may be then formed between the post amorphous region (32) and the reactive layer (42). The reactive layer (42) may be removed to expose the salicidation region (44).

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