Transistor and method of forming the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438166, 438229, 257 57, 257 64, 257 65, H01L 2100, H01L 2184

Patent

active

059465603

ABSTRACT:
A crystalline silicon thin film transistor having an LDD (lightly doped drain) structure and a process for fabricating the same, which comprises introducing a catalyst element for accelerating crystallization at a concentration of 1.times.10.sup.15 cm.sup.-3 or more but less than 2.times.10.sup.19 cm.sup.-3 to the impurity region in an amorphous silicon film, crystallizing the amorphous film thereafter, and after forming gate electrode and gate insulating film, implanting an impurity in a self-aligned manner to establish an LDD structure.

REFERENCES:
patent: 4231809 (1980-11-01), Schmidt
patent: 4746628 (1988-05-01), Takafugi et al.
patent: 5112764 (1992-05-01), Mitra et al.
patent: 5147826 (1992-09-01), Liu et al.
patent: 5254480 (1993-10-01), Tran
patent: 5262654 (1993-11-01), Yamazaki
patent: 5275851 (1994-01-01), Fonash et al.
patent: 5306651 (1994-04-01), Masumo et al.
patent: 5308998 (1994-05-01), Yamazaki et al.
patent: 5403772 (1995-04-01), Zwang et al.
patent: 5501989 (1996-03-01), Takayama et al.
patent: 5508533 (1996-04-01), Takemura
patent: 5531182 (1996-07-01), Yonehara
patent: 5534716 (1996-07-01), Takemura
patent: 5563426 (1996-10-01), Zhang et al.
patent: 5576556 (1996-11-01), Takemura et al.
patent: 5595923 (1997-01-01), Zhang et al.
patent: 5614733 (1997-03-01), Zhang et al.
patent: 5619044 (1997-04-01), Makita et al.
patent: 5696003 (1997-12-01), Makita et al.
C. Hayzelden et al., "In Situ Transmission Electron Microscopy Studies of Silicide-Mediated Crystallization of Amorphous Silicon" Appl. Phys. Lett., 60, 2 (1992) 225.
R.C. Cammarata et al., Appl. Phys. Lett., 51, 14 (1987) 1106 ". . . Ni Implanted Si Films".
Y.N. Erokhin et al., Appl. Phys. Lett., 63, 23 (1993) 3173 "Spatially Confined NiSi.sub.2 Formation at 400.degree. C. . . . ".
S.W. Lee et al., AM-LCD '95 Proceedings, p. 113, "Low temperature poly-si TFT fabrication by nickel-induced lateral crystallization of amorphous silicon films".
Y. Kawazu, H. Kudo, S. Onari, T. Arai, "Low Temperature Crystallization of Hydrogenated Amorphous Silicon Induced by Nickel Silicide Formation"; J.J. Appl. Phys., vol. 29, No. 12, Dec., 1990, pp. 2698-2704.
"Crystallized Si Films By Low-Temperature Rapid Thermal Annealing of Amorphous Silicon", R. Kakkad, J. Smith, W.S. Lau, S.J. Fonash, J. Appl. Phys. 65 (5), Mar. 1, 1989, 1989 American Institute of Physics, pp. 2069-2072.
"Polycrystalline Silicon Thin Film Transistors on Corning 7059 Glass Substrates Using Short Time, Low Temperature Processing", G. Liu, S.J. Fonash, Appl. Phys. Lett. 62 (20), May 17, 1993, 1993 American Institute of Physics, pp. 2554-2556.
"Selective Area Crystallization of Amorphous Silicon Films by Low-Temperature Rapid Thermal Annealing", Gang Liu and S.J. Fonash, Appl. Phys. Lett. 55 (7), Aug. 14, 1989, 1989 American Institute of Physics, pp. 660-662.
"Low Temperature Selective Crystallization of Amorphous Silicon", R. Kakkad, G. Liu, S.J. Fonash, Journal of Non-Crystalline Solids, vol. 115, (1989), pp. 66-68.
S. M. Sze, VLSI Technology, p 397, 1988.
Y. Wada et al., J. Electrochem. Soc., 125(9)(1978)1499, "Grain Growth Mechanism of Heavily Doped Phosphorus-Implanted Polysilicon".
Y. Kawazu et al., J.J. Appl. Phys., 29, 12 (1990) 2698, "Low Temperature Crystallization of a-Si:H . . . by NiSi.sub.2. . . ".
J.J.P. Bruines et al., Appl. Phys. Lett., 50, 9 (1987) 507, ". . . Pulsed Laser Annealing of Amorphous Silicon".
F. Oki et al., J.J. Appl. Phys., 8 (1969) 1056, "Effect of Deposited Metals on Crystallization . . . of a-Ge . . . ".
M.H. Brodsky et al., Bull. Am. Phys. Soc., 16 (1971) 304, "Low Temperature . . . Crystallization of Amorphous Materials".
C. Hayzelden et al., J. Appl. Phys., 73, 12 (1993) 8279 ". . . Silicide Mediated Crystallization of Ni Implanted a-Si . . . ".
T. Hevliel et al. Solid State Communications vol. 85 #11 p.921-4 Mar. 93 (Received after Mar. 22, 1993.
A.V. Dvurechenskii et al., Physica Status Solidi A95, 635 (1986).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Transistor and method of forming the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Transistor and method of forming the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transistor and method of forming the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2428658

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.