Transistor and in-situ fabrication process

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257SE29295

Reexamination Certificate

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07825470

ABSTRACT:
A method of fabricating semiconductor components in-situ and in a continuous integrated sequence includes the steps of providing a single crystal semiconductor substrate, epitaxially growing a first layer of rare earth insulator material on the semiconductor substrate, epitaxially growing a first layer of semiconductor material on the first layer of rare earth insulator material, epitaxially growing a second layer of rare earth insulator material on the first layer of semiconductor material, and epitaxially growing a second layer of semiconductor material on the second layer of rare earth insulator material. The first layer of rare earth insulator material, the first layer of semiconductor material, the second layer of rare earth insulator material, and the second layer of semiconductor material form an in-situ grown structure of overlying layers. The in-situ grown structure is etched to define a semiconductor component and electrical contacts are deposited on the semiconductor component.

REFERENCES:
patent: 4479297 (1984-10-01), Mizutani et al.
patent: 2003/0183885 (2003-10-01), Nishikawa et al.
K N. Tu, et al. “Low Schottky barrier of rare-earth silicide on n-Si”, Appl. Phys. Lett. 38, pp. 626-628 (1981).

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