Transient liquid phase bonding to cold-worked surfaces

Details Transient liquid phase bonding to cold-worked surfaces Transient liquid phase bonding to cold-worked surfaces

2007-01-23

2007-01-23

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

With shaping

C228S193000, C228S194000, C228S195000, C148S522000

Reexamination Certificate

active

10692403

ABSTRACT:
A joint having bond line grains that nucleate in the joint region and grow into the adjoined solid substrates. The resulting bond line grains have a size that is greater than a thickness of a molten region. The surfaces of the substrates are cold worked to a desired degree of residual stress prior to the bonding process so that the recrystallization of the substrate surface necessary for the grains to grow into the substrates results in a reduction in the local free energy.

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