Method to improve SRAM performance and stability

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

Reexamination Certificate

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C438S430000, C257SE21661

Reexamination Certificate

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10921532

ABSTRACT:
A technique is disclosed for increasing the width of a transistor (300) while the transistor itself may be scaled down. The transistor width (382) is increased by forming recesses (352) within shallow trench isolation (STI) regions (328) adjacent to the transistor (300). The recesses (352) provide an area that wraps around the transistor and thereby increases the width (382) of the transistor (300). This wraparound area provides additional space for dopant atom deposition, which facilitates a reduction in random dopant fluctuation (RDF). In this manner, transistors formed in accordance with one or more aspects of the present invention, may yield improved performance when incorporated into SRAM since the probability that such transistors will be more closely matched is increased.

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