Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate
2007-03-13
2007-03-13
Lindsay, Jr., Walter (Department: 2812)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Grooved and refilled with deposited dielectric material
C438S430000, C257SE21661
Reexamination Certificate
active
10921532
ABSTRACT:
A technique is disclosed for increasing the width of a transistor (300) while the transistor itself may be scaled down. The transistor width (382) is increased by forming recesses (352) within shallow trench isolation (STI) regions (328) adjacent to the transistor (300). The recesses (352) provide an area that wraps around the transistor and thereby increases the width (382) of the transistor (300). This wraparound area provides additional space for dopant atom deposition, which facilitates a reduction in random dopant fluctuation (RDF). In this manner, transistors formed in accordance with one or more aspects of the present invention, may yield improved performance when incorporated into SRAM since the probability that such transistors will be more closely matched is increased.
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Cleavelin C. Rinn
Wu Zhiqiang
Yu Shaofeng
Brady W. James
Isaac Stanetta
Keagy Rose Alyssa
Lindsay, Jr. Walter
Telecky , Jr. Frederick J.
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