Transfer molding encapsulation of a semiconductor die with attac

Details Transfer molding encapsulation of a semiconductor die with attac Transfer molding encapsulation of a semiconductor die with attac

1997-08-11

1999-09-28

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257713, 257666, 257675, H01L 2328

Patent

active

059593490

ABSTRACT:
A semiconductor device includes a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First, the dam prevents damage to the mold. Second, the dam prevents encapsulant packaging compound material from flowing onto the heat sink. The dam may be a gasket. The dam may also be a burr created by, for example, stamping the bottom of the heat sink. The dam may include copper, polyamides, and leadlock tape. The dam may be permanently connected to the heat sink for removed following packaging. The dam may be removed mechanically, through the use of heat, or during an electrolytic deflash cycle.

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