Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1990-09-17
1992-07-21
James, Andrew J.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
174256, 523139, H01L 2328
Patent
active
051327783
ABSTRACT:
Briefly, according to the invention, a transfer molding compound is made from an epoxide resin, a cyanate ester, and a catalyst. The molding compound is used to encapsulate semiconductor devices to fabricate individual packages or to encapsulate devices mounted directly on a circuit carrying substrate.
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Juskey Frank J.
Papageorge Marc V.
Pennisi Robert W.
Crane Sara W.
Dorinski Dale W.
James Andrew J.
Motorola Inc.
Nichols Daniel K.
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