Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-11-18
2000-10-03
Gandhi, Jayprakash N.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361736, 361752, 361758, 257679, 439946, 26427211, H05K 114, H05K 500, H01L 2302
Patent
active
061281956
ABSTRACT:
A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.
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Brueggeman Michael A.
Weber Patrick O.
Gandhi Jayprakash N.
Hestia Technologies, Inc.
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