Transfer mold semiconductor packaging processes

Details Transfer mold semiconductor packaging processes Transfer mold semiconductor packaging processes

2006-12-12

2006-12-12

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S015000, C438S025000, C438S026000, C438S051000, C438S055000, C438S064000, C438S112000, C438S124000, C438S127000

Reexamination Certificate

active

07148083

ABSTRACT:
In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.

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