Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-12-12
2006-12-12
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S015000, C438S025000, C438S026000, C438S051000, C438S055000, C438S064000, C438S112000, C438S124000, C438S127000
Reexamination Certificate
active
07148083
ABSTRACT:
In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.
REFERENCES:
patent: 4556896 (1985-12-01), Meddles
patent: 5144412 (1992-09-01), Chang et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5258649 (1993-11-01), Tanaka et al.
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5571071 (1996-11-01), Shapiro
patent: 5767446 (1998-06-01), Ha et al.
patent: 5900669 (1999-05-01), Knapp et al.
patent: 5953589 (1999-09-01), Shim et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6054755 (2000-04-01), Takamichi et al.
patent: 6064111 (2000-05-01), Sota et al.
patent: 6107683 (2000-08-01), Castro et al.
patent: 6107689 (2000-08-01), Kozono
patent: 6111315 (2000-08-01), Stearns et al.
patent: 6214645 (2001-04-01), Kim
patent: 6221690 (2001-04-01), Taniguchi et al.
patent: 6246124 (2001-06-01), Jimarez et al.
patent: 6331453 (2001-12-01), Bolken et al.
patent: 6365979 (2002-04-01), Miyajima
patent: 6379997 (2002-04-01), Kawahara et al.
patent: 6452113 (2002-09-01), Dibene et al.
patent: 6560122 (2003-05-01), Weber
patent: 6580620 (2003-06-01), Kim
patent: 2001/0002321 (2001-05-01), Castro
patent: 2001/0009301 (2001-07-01), Azuma
patent: 2002/0001880 (2002-01-01), Kobayashi
patent: 2002/0074590 (2002-06-01), Huang
patent: 2002/0149104 (2002-10-01), Huang
patent: 404177753 (1992-06-01), None
patent: 11-260954 (1999-09-01), None
Merix Corporation, ABSTRACT:Types of Soldermasks and Their Applications(1997) 5 pages.
Toshiba Chemical Corporation, Technical Information: High Tg Epoxy Molding Compound for BGA Package, KE-1100ARH (pre-Jul. 2000) 6 pages.
Tummata, Rao R. et al.,Plastic Packaging, Microelectronics Packaging Handbook (Jan. 1997) pp. 560-589.
Kinsman Larry
Reeder Jeff
Wensel Richard
Jr. Carl Whitehead
Micro)n Technology, Inc.
Mitchell James M.
Wells St. John P.S.
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