Transfer modlded electronic package having a passage means

Details Transfer modlded electronic package having a passage means Transfer modlded electronic package having a passage means

Filed on

1995-05-26

Date issued

1997-07-29

Examiner

Meier, Stephen

Patent Class

Active solid-state devices (e.g., transistors, solid-state diode

SubClass

Housing or package

SubSubClass

Insulating material

Other Related Categories

257667, 257707, 257787, 257790, 361709, 361719, H01L 2310, H01L 2334

Type

Patent

Status

active

Patent number

056524633

Description

ABSTRACT:
A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink to encapsulate the package.

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