Transducer package with transducer die unsupported by a...

Details Transducer package with transducer die unsupported by a... Transducer package with transducer die unsupported by a...

2009-08-18

2010-11-02

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S723000, C257S787000

Reexamination Certificate

active

07825509

ABSTRACT:
A surface mountable transducer package is provided, the design of which allows a thin package profile to be achieved. An encapsulation layer bonds to a surface of each of the terminal pads and encapsulates a portion of the transducer and at least a portion of the signal processing IC.

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patent: 2008/0042223 (2008-02-01), Liao et al.
patent: 2010/0052082 (2010-03-01), Lee et al.

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