Totally enclosed hermetic electronic module

Details Totally enclosed hermetic electronic module Totally enclosed hermetic electronic module

1990-11-30

1993-10-05

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Portion of housing of specific materials

257699, 257710, 257712, 174 521, 361715, 361730, H01L 2302, H01L 2312

Patent

active

052508455

ABSTRACT:
The hermetic module (10) has a frame 12 with an integral heat sink panel (20) extending thereacross between the side walls (14, 16). High-density integrated circuit electronics are mounted on the heat sink panel by hybrid assembly techniques. Covers (36, 38) are welded to the walls to achieve closure. Feedthrough 74 includes connector block (84) extending through an opening in front bulkhead (76). The front bulkhead is Kovar clad, and seal is achieved by means of a Kovar flexible seal extending between the Kovar side of the front bulkhead and the Kovar ring on the connector block.

REFERENCES:
patent: 3777220 (1973-12-01), Tatusko et al.
patent: 4009752 (1977-03-01), Wilson
patent: 4372037 (1983-02-01), Scapple et al.
patent: 4577056 (1986-03-01), Butt
patent: 4963414 (1990-10-01), LeVasseur et al.

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