Total immersion crystal growth

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156617H, 156617SP, C30B 2702

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active

046541101

ABSTRACT:
Crystals of wide band gap materials are produced by positioning a holder (106, 274) receiving a seed crystal (106) at the interface (36, 270) between a body (26, 206) of molten wide band gap material and an overlying layer (28 or 288) of temperature-controlled, encapsulating liquid. The temperature of the layer decreases from the crystallization temperature of the crystal at the interface with the melt to a substantially lower temperature at which formation of crystal defects does not occur, suitably a temperature of 200.degree. C. to 600.degree. C. After initiation of crystal growth, the leading edge of the crystal (212) is pulled through the layer until the leading edge of the crystal enters the ambient gas headspace (30, 265) which may also be temperature controlled. The length of the column of liquid encapsulant may exceed the length of the crystal such that the leading edge and trailing edge of the crystal are both simultaneously with the column of the crystal.
The crystal can be pulled vertically by means of a pulling-rotation assembly (20) or horizontally by means of a low-angle withdrawal mechanism (210). The temperature of the encapsulating layer is controlled by heating and/or cooling elements (35, 230) submerged with the layers and connected in closed loop with power supplies (50, 52, 240) by means of temperature sensing elements (52, 239). These elements control and provide nucleation and growth of a more perfect crystal in the elongated, heat exchange, encapsulating fluid medium.

REFERENCES:
patent: 3857679 (1974-12-01), Allred
patent: 3980438 (1976-09-01), Castoguoy et al.
patent: 4225378 (1980-09-01), Garrison
patent: 4329195 (1982-05-01), Kudo
patent: 4483735 (1984-11-01), Inada et al.
Weiner et al., Journal of Electrochem. Soc. vol. 118, No. 2 (Solid State Science), 2/77, pp. 301-306.
Nygren et al., Journal of Electrochem. Soc.: Solid State Science vol. 118, No. 2, pp. 306-312.

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