Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Patent
1996-11-22
1998-11-03
Padgett, Marianne
Etching a substrate: processes
Gas phase etching of substrate
Application of energy to the gaseous etchant or to the...
216 66, 216 67, 216 94, 156345LT, 156345B, 156345P, 427533, 427537, 427536, 427555, 438694, 438710, 438712, 438733, B05D 300
Patent
active
058303766
ABSTRACT:
A maskless process generates a patterned coating on a polymeric substrate, wherein the pattern is at least partially defined by the substrate topography. The process uses a high intensity/high fluence energy source to strike a coated substrate, thus selectively removing a portion of the coating. The amount and area of the coating removed is dependent on the substrate topography and the applied energy, and this forms a pattern of residual coating material on the substrate.
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Bohlke Susan Nord
Dunn Douglas S.
Jellum Gregory M.
Ouderkirk Andrew J.
Burtis John A.
Minnesota Mining and Manufacturing Company
Padgett Marianne
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