Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-01-10
2006-01-10
Walke, Amanda (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S270100
Reexamination Certificate
active
06984482
ABSTRACT:
The present invention provides an over-coating composition comprising a basic compound for coating a photoresist composition to provide a vertical photoresist pattern.
REFERENCES:
patent: 3652273 (1972-03-01), Hioo
patent: 3895949 (1975-07-01), Akamatsu et al.
patent: 4428871 (1984-01-01), Ward et al.
patent: 5624789 (1997-04-01), Rahman et al.
patent: 5672577 (1997-09-01), Lee
patent: 5783362 (1998-07-01), Wakiya et al.
patent: 5911835 (1999-06-01), Lee et al.
patent: 5985519 (1999-11-01), Kakamu et al.
patent: 6000411 (1999-12-01), Lee
patent: 2001/0003030 (2001-06-01), Jung et al.
patent: 44 15 113 (1994-11-01), None
patent: 0 275 147 (1988-07-01), None
patent: 0 488 372 (1992-06-01), None
patent: 0 703 499 (1996-03-01), None
patent: 0 751 433 (1997-01-01), None
patent: 0 803 776 (1997-10-01), None
patent: 94-0004723 (1994-03-01), None
patent: 99-003857 (1999-01-01), None
patent: 99-004682 (1999-01-01), None
patent: WO 92/05474 (1992-04-01), None
U.S. Appl. No. 09/728,535, filed Dec. 1, 2000, Jae Chang Jung et al.
W.D. Hinsberg et al., “Influence of Polymer Properties on Airborne Chemical Contamination of Chemically Amplified Resists,” SPIE vol. 1925, 1993, pp. 43-52.
Hiroshi Ito et al., “Approach Toward Environmental Stabilization of Chemical Amplification Resists,” Journal of Photopolymer Science and Technology, vol. 6, No. 4, 1993, pp. 547-562.
Greg Breyta et al., “The Lithographic Performance and Contamination Resistance of a New Family of Chemically Amplified DLV Photoresists,” Journal of Photopolymer Science and Technology, vol. 7, No. 3, 1994, pp. 449-460.
Hiroshi Ito et al., “Environmentally Stable Chemical Amplification Positive Resist: Principle, Chemistry, Contamination Resistance, and Lithographic Feasibility,” Journal of Photopolymer Science and Technology, vol. 7, No. 3, 1994, pp. 433-448.
Hiroshi Ito, et al., “Annealing Concept for the Design of Environmentally Stable Chemical Amplification Resists,” Journal of Photopolymer Science and Technology, vol. 8, No. 4, 1995, pp. 505-518.
Yoshio Kawai et al., “Environmental Stability of a KrF Chemically Amplified Positive Resist with an Organic Base,” Journal of Photopolymer Science and Technology, vol. 8, No. 4, 1995, pp. 535-542.
Satoshi Saito et al., “High Performance Chemically Amplified Positive Electron-Beam Resist: Optimization of Base Additives for Environmental Stabilization,” Journal of Photopolymer Science and Technology, vol. 9, No. 4, 1996, pp. 677-684.
S. Funato et al., “Photodecomposable Bases: A Novel Concept to Stabilize Chemically Amplified Resists,” Journal of Photopolymer Science and Technology, vol. 8, No. 4, 1995, pp. 543-554.
Jiro Nakamura et al., “Effect of Overcoats on Environmental Stability of a Chemically Amplified Positive Resist Against Water and Organic Bases,” Journal of Photopolymer Science and Technology, vol. 8, No. 4, 1995, pp. 555-560.
Akira Oikawa et al., “Stabilization of the Chemically Amplified Resist Process,” Journal of Photopolymer Science and Technology, vol. 8, No. 4, 1995, pp. 519-524.
WPI Abstract, EP 0290916 A2.
WPI Abstract, DE 4117127 A1.
WPI Abstract, DE 4415113 A1.
Japan Patent Abstract, Publication No. 08305032, dated Nov. 11, 1996.
Baik Ki Ho
Hong Sung Eun
Jung Jae Chang
Jung Min Ho
Kim Hyeong Soo
Hynix / Semiconductor Inc.
Townsend and Townsend / and Crew LLP
Walke Amanda
LandOfFree
Top-coating composition for photoresist and process for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Top-coating composition for photoresist and process for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Top-coating composition for photoresist and process for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3602763