Titanium-tungsten etching solutions

Details Titanium-tungsten etching solutions Titanium-tungsten etching solutions

1991-07-02

1993-05-18

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

252 791, 252 795, C23F 100

Patent

active

052118070

ABSTRACT:
Etchant solutions for titanium-tungsten, which include at least one oxidizing agent and at least one fluoride salt. Also disclosed is a method for etching TiW utilizing these etchants.

REFERENCES:
patent: 2566615 (1951-09-01), Keilholtz et al.
patent: 2876144 (1959-03-01), Bomberger et al.
patent: 3468774 (1969-09-01), Kendall
patent: 3601666 (1971-08-01), Leedy
patent: 4331476 (1982-05-01), Helderman et al.
patent: 4410396 (1983-10-01), Sommers et al.
patent: 4486946 (1984-12-01), Jopke, Jr. et al.
patent: 4491860 (1985-01-01), Lim
patent: 4671852 (1987-06-01), Pyke
patent: 4711701 (1987-12-01), McLevige
patent: 4740485 (1988-04-01), Sharpe-Geisler
patent: 4782032 (1988-11-01), Geisberger et al.
patent: 4787958 (1988-11-01), Lytle
patent: 4814429 (1989-03-01), Van Oekel
patent: 4849376 (1989-07-01), Balzan et al.
patent: 4880708 (1989-11-01), Sharma et al.
patent: 4927505 (1990-05-01), Sharma et al.
Shankoff et al, "High Resolution Tungsten Patterning Using Buffered, Mildly Basic Etching Solutions," Journal of the Electrochemical Society, vol. 122, No. 2, (Feb. 1975) pp. 294-298.
Nowicki et al, "Studies of the Ti-W/Au Metallization on Aluminum," Thin Solid Films, vol. 53 (1978), pp. 195.200.
Denning et al, "Reliability of High Temperature I2L Integrated Circuits," IEEE/IRPS Proc. 1984, International Reliability Physics Symposium, pp. 30-36.
Meyer et al, "Metallurgy of TiW/Au/Cu System from TAB Assembly," Journal of Vacuum Science Technology, May/Jun. 1985, pp. 772-776.

Affiliated with

Also associated with

Rating

Titanium-tungsten etching solutions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Titanium-tungsten etching solutions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Titanium-tungsten etching solutions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-802065