Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1987-05-11
1989-04-11
Valentine, Donald R.
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419221, 204298, 419 13, 419 49, 423411, 501 96, C23C 1434, C22C 3200, C01B 21076, C04B 3558
Patent
active
048203939
ABSTRACT:
The present invention provides a sputter target for the deposition of titanium nitride films. The sputter target has a target face comprising titanium nitride having a density of at least 90% of the theoretical density of 100% pure titanium nitride. The sputter target is prepared by subjecting titanium nitride powder to hot isostatic pressure.
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Brat Teodoro E.
Wickersham Charles E.
Tosoh SMD, Inc.
Valentine Donald R.
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