Titanium nitride film-MOCVD method incorporating use of tetrakis

Coating processes – Coating by vapor – gas – or smoke

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427 99, 4272551, 4272552, C23C 1618

Patent

active

056723857

ABSTRACT:
The present invention provides a method of depositing a titanium nitride thin film with good coverage even in a hole with a high aspect ratio by using tetrakisdialkylaminotitanium. In this method, a raw material gas of tetrakisdialkylaminotitanium is introduced into a reactor through a raw material gas introduction system. When the raw material gas is supplied to a substrate which is previously heated by a holder temperature control mechanism, predetermined thermally chemical reaction takes place to deposit a thin film consisting of titanium nitride as a main component. The pressure in the reactor is controlled by an exhaust system so as to be maintained at a predetermined value in the range of about 0.1 to 15 Pa.

REFERENCES:
patent: 5393565 (1995-02-01), Suzuki et al.
patent: 5399379 (1995-03-01), Sandhu
patent: 5478780 (1995-12-01), Koerner et al.
patent: 5480684 (1996-01-01), Sandhu
So Won KIM et al., "Low Pressure and Low Temperature MOCVD of TiN Thin Films," Proceedings of the 48th Symposium on Semiconductors and Integrated Circuits Technology, Tokyo, Japan, Jun. 1-2, 1995, cover page, pp. 36-41.
M. Eizenberg et al., "TiCN: A new chemical vapor deposited contact barrier metallization for submicron devices," Appl. Phys. Lett. 65, (19), 7 Nov. 1994, pp. 2416-2418.
Ivo J. Raaijmakers, "Low temperature metal-organic chemical vapor depOsition of advanced barrier layers for the microelectronics industry," Thin Solid Films, 247, 1994, pp. 85-93. (no month).
Robert L. Jackson et al., "MOCVD of Titanium Nitride from TDEAT and NH.sub.3 --Process Variables Affecting Step-coverage, Resistivity and Impurity Levels," Advanced Metalization For ULSI Applications, Oct. 4-6, 1994, cover page, pp. 3-9.
Corneille et al. J. VAc. Sci. Technol. A(13)3, May/Jun. 1995. pp. 1116-11120.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Titanium nitride film-MOCVD method incorporating use of tetrakis does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Titanium nitride film-MOCVD method incorporating use of tetrakis, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Titanium nitride film-MOCVD method incorporating use of tetrakis will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2255228

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.