Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2005-10-18
2005-10-18
Cuneo, Kamand (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
Reexamination Certificate
active
06956174
ABSTRACT:
An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at lease a portion of the conductive contact terminal immediately adjacent the first intimate bond.
REFERENCES:
patent: 2869040 (1959-01-01), Pifer
patent: 3662454 (1972-05-01), Miller
patent: 3795037 (1974-03-01), Luttmer
patent: 3842189 (1974-10-01), Southgate
patent: 4085502 (1978-04-01), Ostman et al.
patent: 4523144 (1985-06-01), Okubo et al.
patent: 4548451 (1985-10-01), Benarr et al.
patent: 4553192 (1985-11-01), Babuka et al.
patent: 4634199 (1987-01-01), Anhalt et al.
patent: 4667219 (1987-05-01), Lee et al.
patent: 4705205 (1987-11-01), Allen et al.
patent: 4707657 (1987-11-01), Boegh-Petersen
patent: 4724383 (1988-02-01), Hart
patent: 4732313 (1988-03-01), Kobayashi et al.
patent: 4751199 (1988-06-01), Phy
patent: 4757256 (1988-07-01), Whann et al.
patent: 4780836 (1988-10-01), Miyazaki et al.
patent: 4918032 (1990-04-01), Jain et al.
patent: 4998885 (1991-03-01), Beaman
patent: 5007576 (1991-04-01), Congleton et al.
patent: 5045410 (1991-09-01), Hiesbock et al.
patent: 5047711 (1991-09-01), Smith et al.
patent: 5059143 (1991-10-01), Grabbe
patent: 5066907 (1991-11-01), Tarzwell et al.
patent: 5067007 (1991-11-01), Kanji et al.
patent: 5071359 (1991-12-01), Arnio et al.
patent: 5072520 (1991-12-01), Nelson
patent: 5095187 (1992-03-01), Gliga
patent: 5097100 (1992-03-01), Jackson
patent: 5109596 (1992-05-01), Driller et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5136367 (1992-08-01), Chiu
patent: 5139427 (1992-08-01), Boyd et al.
patent: 5157325 (1992-10-01), Murphy
patent: 5166774 (1992-11-01), Banerji et al.
patent: 5189507 (1993-02-01), Carlomagno et al.
patent: 5218292 (1993-06-01), Goto
patent: 5228861 (1993-07-01), Grabbe
patent: 5237743 (1993-08-01), Busacco et al.
patent: 5240588 (1993-08-01), Uchida
patent: 5245751 (1993-09-01), Locke et al.
patent: 5317479 (1994-05-01), Pai et al.
patent: 5350947 (1994-09-01), Takekawa et al.
patent: 5379515 (1995-01-01), Kondo et al.
patent: 5399982 (1995-03-01), Driller et al.
patent: 5414298 (1995-05-01), Grube et al.
patent: 5442282 (1995-08-01), Rostoker et al.
patent: 5455390 (1995-10-01), DiStefano et al.
patent: 5476211 (1995-12-01), Khandros
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5525545 (1996-06-01), Grube et al.
patent: 5557501 (1996-09-01), DiStefano et al.
patent: 5613861 (1997-03-01), Smith et al.
patent: 1 026 876 (1958-03-01), None
patent: 0 402 756 (1990-12-01), None
patent: 0 500 074 (1992-08-01), None
patent: 0 593 966 (1994-04-01), None
patent: 0 614 089 (1994-09-01), None
patent: 0 708 388 (1996-04-01), None
patent: 2 643 753 (1990-08-01), None
patent: 2 680 284 (1993-02-01), None
patent: 54-146581 (1979-11-01), None
patent: 56-26446 (1981-03-01), None
patent: 59-88860 (1984-05-01), None
patent: 60-10298 (1985-04-01), None
patent: 61244057 (1986-10-01), None
patent: 61287254 (1986-12-01), None
patent: 62-160373 (1987-10-01), None
patent: 3-142847 (1991-06-01), None
patent: 1003396 (1983-03-01), None
patent: WO 91/12706 (1991-08-01), None
patent: WO 96/02959 (1996-02-01), None
Shih et al., “A Novel Elastromeric Connector for Packaging Interconnections, Testing and Burn-in Applications”, IEEE Journal, May 21, 1995, pp. 126-133.
Kong, et al., “Integrated electrostatically resonant scan tip for an atomic force microscope”, J. Vac. Sci. Technol. B 11 (3), May/Jun. 1993, pp. 634-641.
“Compliant Lead Reform Tool and Process”, IBM Technical Disclosure Bulletin, vol. 31, No. 6, Nov. 1988, pp. 160-162.
U. Renz, “Multipoint Test Probe for Printed Cards”, IBM Technical Disclosure Bulletin, vol. 17, No. 2, Jul. 1974, pp. 2 pgs. total.
“Chip Column Package Structure”, IBM Technical Disclosure Bulletin, vol. 40, No. 08, Aug. 1997, pp. 117-118.
Alan D. Knight, “MCM-to-Printed Wiring Board (Second Level) Connection Technology Options”, pp. 487-523.
Beaman et al., “Elastomeric Connector For MCM and Test Applications”, ICEMM Proceedings '93, pp. 341-346.
“Cooling System for Semiconductor Modules”, IBM Technical Disclosure Bulletin, Aug. 1983, pp. 2 pgs. total.
“Method of Testing Chips and Joining Chips to Substrates”, Research Disclosure, Feb. 1991, No. 322, pp. 1.
Weast, Handbook of Chemistry and Physics (1975-1976), pp. D-171 to D-172, (CRC Press, Cleveland, Ohio).
Khandros Igor Y.
Mathieu Gaetan L.
Blakely & Sokoloff, Taylor & Zafman
Burraston N. Kenneth
Cuneo Kamand
FormFactor Inc.
Norris Jeremy
LandOfFree
Tip structures does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Tip structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tip structures will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3453470