Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1992-05-18
1994-02-15
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430311, 430314, 430317, 430318, 430329, 430950, 156643, 1566591, G03F 726, G03C 500
Patent
active
052866084
ABSTRACT:
A new method of producing an anti-reflection coating is described. The reflective metal layer of an integrated circuit is covered with titanium. The titanium layer is oxidized. The resulting titanium oxide layer is the anti-reflection coating (ARC) of the present invention. This ARC layer is covered with photoresist. The photoresist layer is selectively exposed to light by directing light through a patterned mask to form a pattern on the photoresist layer. The metal layer is etched in accordance with the pattern. The remaining resist is stripped off. An inter-metal dielectric layer is deposited over the patterned first metal and titanium oxide layers. A second photoresist layer is deposited and selectively exposed to light through a second photomask. The titanium oxide layer again acts to limit the reflection of light off the first metal layer and through the transparent inter-metal dielectric. The exposed inter-metal layer is etched away to the underlying first metal layer. The remaining photoresist is removed. In-situ sputtering, performed to remove native metal oxide, also removes any of the remaining titanium oxide layer. This results in the desired pattern of openings in the inter-metal dielectric. A subsequent metal layer can be deposited, making contact with the first metal through the openings created in the inter-metal dielectric.
REFERENCES:
patent: 4495220 (1985-01-01), Wolf
patent: 4767660 (1988-08-01), Hosoda
patent: 4820611 (1989-04-01), Arnold
Duda Kathleen
Industrial Technology Research Institute
McCamish Marion E.
Saile George O.
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