Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-03-07
1987-06-23
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29571, 156644, 156646, 156653, 357 41, 357 59, B44C 122, C03C 1500, C03C 2506
Patent
active
046750738
ABSTRACT:
A plasma etch process for etching titanium nitride selectively with respect to titanium silicides. A reducing electrode, a low flow rate, and a non-copious fluorine source (such as CF.sub.4) are used to achieve a fluorine-deficient plasma. Preferably the substrate temperature is allowed to rise above 50 C during etching.
REFERENCES:
patent: 4481706 (1984-11-01), Roche
Comfort James T.
Groover III Robert
Powell William A.
Sharp Mel
Texas Instruments Incorporated
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