Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2007-05-29
2007-05-29
Chawan, Sheela (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C324S537000, C324S754090, C324S758010
Reexamination Certificate
active
10457968
ABSTRACT:
A system for probe-less non-invasive detection of electrical signals from integrated circuit devices is disclosed. The system includes an illumination source, collection optics, imaging optics, and a photon sensor. In a navigation mode, the light source is activated and the imaging optics is used to identify the target area on the chip and appropriately position the collection optics. Once the collection optics is appropriately positioned, the light source is deactivated and the photon sensor is used to detect photons emitted from the chip. No mention of cooling (active device measurement capability) and advanced optics to detect the features (SIL).
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Cotton Daniel Murdoch
Pakdaman Nader
Vickers James Squire
Wong Thomas
Bach Joseph
Chawan Sheela
Credence Systems Corporation
Sughrue & Mion, PLLC
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