Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-04-24
2007-04-24
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE23062
Reexamination Certificate
active
11277042
ABSTRACT:
A method for routing a plurality of signal traces out of a plurality of corresponding bumper pads for implementation of a die on a multi-layer circuit board includes utilizing the plurality of bumper pads positioned in a periphery area of the die; utilizing a plurality of power/ground bumper pads positioned in a center area of the die; assigning a plurality of signal traces corresponding to a plurality of bumper pads as a plurality of first-layer traces being routed in a first layer of the multi-layer circuit board; assigning a plurality of signal traces corresponding to a plurality of bumper pads as a plurality of second-layer traces being routed in a second layer of the multi-layer circuit board; routing the plurality of first-layer traces straight away from the die; and routing the plurality of second-layer traces with a turn not to be vertically underneath the first-layer traces.
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Chao Tze-Hsiang
Fang Chung-Yi
Su Yi-Show
Hsu Winston
Lebentritt Michael
Silicon Integrated Systems Corp.
Stevenson Andre′
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