Tightness test for MEMS or for small encapsulated components

Details Tightness test for MEMS or for small encapsulated components Tightness test for MEMS or for small encapsulated components

2005-06-29

2009-08-11

Caputo, Lisa M (Department: 2855)

Thermal measuring and testing

Leak or flaw detection

With heating or cooling of specimen for test

C374S057000, C374S208000, C374S141000

Reexamination Certificate

active

07572053

ABSTRACT:
A tightness testing method for a MEMS or small encapsulated component, the MEMS or small component being housed in a cavity of a carrier. The cavity being sealed and containing a gas having a different density to the density it would have if subjected to the pressure of the medium outside the cavity. The method measures the density of the gas contained in the cavity.

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Puers, R. et al., “The NanoPirani- and Extremely Miniaturized Pressure Sensor Fabricated by Focused Ion Beam Rapid Prototyping”, Sensors and Actuators, vol. 97-98, pp. 208-214, 2002.

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