Thyristor-based device with trench dielectric material

Semiconductor device manufacturing: process – Making regenerative-type switching device

Reexamination Certificate

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C438S292000, C438S295000, C438S296000, C438S115000, C257SE21388, C257SE21389, C257SE21390, C257SE21392

Reexamination Certificate

active

07374974

ABSTRACT:
A thyristor-based semiconductor device includes a thyristor body that has at least one region in the substrate and a thyristor control port in a trenched region of the device substrate. According to an example embodiment of the present invention, the trench is at least partially filled with a dielectric material and a control port adapted to capacitively couple to the at least one thyristor body region in the substrate. In a more specific implementation, the dielectric material includes deposited dielectric material that is adapted to exhibit resistance to voltage-induced stress that thermally-grown dielectric materials generally exhibit. In another implementation, the dielectric material includes thermally-grown dielectric material, and when used in connection with highly-doped material in the trench, grows faster on the highly-doped material than on a sidewall of the trench that faces the at least on thyristor body region in the substrate. In still another implementation, the dielectric material includes both a thermally-grown dielectric material and a deposited dielectric material. These approaches are particularly useful, for example, in high-density and other applications where thermally-stable dielectric materials are desirable and/or where dielectric material growth at different rates is desirable.

REFERENCES:
patent: 4404735 (1983-09-01), Sakurai
patent: 4797373 (1989-01-01), Malhi et al.
patent: 5528062 (1996-06-01), Hsieh et al.
patent: 5801417 (1998-09-01), Tsang et al.
patent: 5838026 (1998-11-01), Kitagawa et al.
patent: 5998833 (1999-12-01), Baliga
patent: 6104045 (2000-08-01), Forbes et al.
patent: 6114727 (2000-09-01), Ogura et al.
patent: 6225165 (2001-05-01), Noble, Jr. et al.
patent: 6229161 (2001-05-01), Nemati et al.
General definition of “Thyristor” and “silicon-controlled rectifier” at http://www.xreferplus.com/search.jsp;jsessionid=61373D0D3CE042E0F306D7B7C4BAE699; search word Thyristor and silicon-controlled rectifier.
K. DeMeyer, S. Kubicek and H. van Meer, Raised Source/Drains with Disposable Spacers for sub 100 nm CMOS Technologies, Extended Abstracts of International Workshop on Junction Technology 2001.
Mark Rodder and D. Yeakley, Raised Source/Drain MOSFET with Dual Sidewall Spacers, IEEE Electron Device Letters, vol. 12, No. 3, Mar. 1991.
Yang-Kyu Choi, Daewon Ha, Tsu-Jae King and Chenming Hu, Nanoscale Ultrathin PMOSFETs with Raised Selective Germanium Source/Drain, IEEE Electron Device Letters, vol. 22, No. 9, Sep. 2001.
N. Lindert, Y. K. Choi, L. Chang, E. Anderson, W. C. Lee, T. J. King, J. Bokor, and C. Hu, Quasi-Planar FinFETs with Selectively Grown Germanium Raised Source/Drain, 2001 IEEE International SOI Conference, Oct. 2001.
T. Ohguro, H. Naruse, H. Sugaya, S. Nakamura, E. Morifuji, H. Kimijima, T. Yoshitomi, T. Morimoto, H.S. Momose, Y. Katsumata, and H. Iwai, High Performance RF Characteristics of Raised Gate/Source/Drain CMOS with Co Salicide, 1998 Symposium on VLSI Technology Digest of Technical Papers.
Hsiang-Jen Huang, Kun-Ming Chen, Tiao-Yuan Huang, Tien-Sheng Chao, Guo-Wei Huang, Chao-Hsin Chien, and Chun-Yen Chang, Improved Low Temperature Characteristics of P-Channel MOSFETs with Si1-xGex Raised Source and Drain, IEEE Transactions on Electron Devices, vol. 48, No. 8, Aug. 2001.
Nemati, Farid, and Plummer, James, D., “A Novel High Density, Low voltage SRAM Cell with a Vertical NDR Device,” VLSI Technology Technical Digest, Jun. 1998.
Stanley Wolf Ph.D. and Richard N. Tauber Ph.D., Silicon Processing for the VLSI Era, vol. 1, 1986, p. 285-286.
Nemati, Farid, and Plummer, James, D., “A Novel Thyristor-Based SRAM Cell (T-RAM) for High Speed, Low Voltage, Giga-Scale Memories,” International Electron Device Meeting Technical Digest, 1999.
Ponomarev et al., High Performance Deep SubMicron CMOS Technologies with Polycrystalline-SeGe Gates, IEEE Transactions on Electron Devices, vol. 47, No. 4, pp. 848-855, Apr. 2000.

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