Through-wafer interconnects for photoimager and memory wafers

Details Through-wafer interconnects for photoimager and memory wafers Through-wafer interconnects for photoimager and memory wafers

2011-06-07

2011-06-07

Smoot, Stephen W (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With electrical contact in hole in semiconductor

C257S738000, C257S774000, C257SE23011

Reexamination Certificate

active

07956443

ABSTRACT:
A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

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