Through-the-substrate investigation of flip-chip IC's

Details Through-the-substrate investigation of flip-chip IC's Through-the-substrate investigation of flip-chip IC's

1997-03-03

1998-10-13

Anderson, Bruce

Radiant energy

Inspection of solids or liquids by charged particles

Methods

250309, 2504911, 25049221, H01J 3730

Patent

active

058215492

ABSTRACT:
Methods are provided for exposing a selected feature of an IC device, such as a selected conductor, from the back side of the substrate without disturbing adjacent features of the device, such as active regions. One such method comprises: (a) determining a region of the IC device in which the selected feature is located; (b) acquiring from the back side of the substrate an IR optical microscope image of the region; (c) aligning the IR optical microscope image with a coordinate system of a milling system; and (d) using structures visible in the IR optical microscope image as a guide, operating the milling system to expose the selected feature from the back side of the IC device without disturbing adjacent features.

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