Through-hole via on saw streets

Details Through-hole via on saw streets Through-hole via on saw streets

2007-05-04

2009-08-04

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S458000, C438S462000, C438S464000

Reexamination Certificate

active

07569421

ABSTRACT:
A semiconductor device is manufactured by, first, providing a wafer designated with a saw street guide. The wafer is taped with a dicing tape. The wafer is singulated along the saw street guide into a plurality of dies having a plurality of gaps between each of the plurality of dies. The dicing tape is stretched to expand the plurality of gaps to a predetermined distance. An organic material is deposited into each of the plurality of gaps. A top surface of the organic material is substantially coplanar with a top surface of a first die of the plurality of dies. A plurality of via holes is formed in the organic material. Each of the plurality of via holes is patterned to each of a plurality of bond pad locations on the plurality of dies. A conductive material is deposited in each of the plurality of via holes.

REFERENCES:
patent: 6420244 (2002-07-01), Lee
patent: 6852607 (2005-02-01), Song et al.
patent: 2005/0046002 (2005-03-01), Lee et al.

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