Through hole interconnection structure for semiconductor wafer

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S773000, C257S774000, C257S775000, C257S777000, C257SE23169, C257SE23174, C257SE23175

Reexamination Certificate

active

08058708

ABSTRACT:
A through-hole interconnection structure for a semiconductor wafer, in which: the each wafer includes at least a first wafer and a second wafer electrically connected to the first wafer; an electrical signal connecting section of the second wafer is provided to protrude from a bonding surface of the second wafer, the bonding surface being bonded with the first wafer; and the electrical signal connecting section has a cross section with a curved line or two or more straight lines extending in different directions when the second wafer is seen along a cross section parallel to the bonding surface.

REFERENCES:
patent: 5998808 (1999-12-01), Matsushita
patent: 7132731 (2006-11-01), Wood et al.
patent: 7525186 (2009-04-01), Kim et al.
patent: 7679179 (2010-03-01), Jeung et al.
patent: 2002/0190371 (2002-12-01), Mashino et al.
patent: 2004/0188822 (2004-09-01), Hara
patent: 2004/0238927 (2004-12-01), Miyazawa
patent: 2005/0001320 (2005-01-01), Yamaguchi
patent: 2005/0017338 (2005-01-01), Fukazawa
patent: 2006/0118965 (2006-06-01), Matsui
patent: 2007/0134819 (2007-06-01), Uchiyama
patent: 11-261000 (1999-09-01), None
patent: 2007-59769 (2007-03-01), None
patent: WO 2007/024022 (2007-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Through hole interconnection structure for semiconductor wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Through hole interconnection structure for semiconductor wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Through hole interconnection structure for semiconductor wafer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4278231

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.