Through hole interconnection structure for semiconductor wafer

Details Through hole interconnection structure for semiconductor wafer Through hole interconnection structure for semiconductor wafer

2008-08-20

2011-11-15

Lee, Eugene (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With electrical contact in hole in semiconductor

C257S773000, C257S774000, C257S775000, C257S777000, C257SE23169, C257SE23174, C257SE23175

Reexamination Certificate

active

08058708

ABSTRACT:
A through-hole interconnection structure for a semiconductor wafer, in which: the each wafer includes at least a first wafer and a second wafer electrically connected to the first wafer; an electrical signal connecting section of the second wafer is provided to protrude from a bonding surface of the second wafer, the bonding surface being bonded with the first wafer; and the electrical signal connecting section has a cross section with a curved line or two or more straight lines extending in different directions when the second wafer is seen along a cross section parallel to the bonding surface.

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