Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-03-21
2006-03-21
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S714000
Reexamination Certificate
active
07015572
ABSTRACT:
Semiconductor chips are stacked on a first main surface of an interconnect substrate. The semiconductor chips have a base and connection bumps. Mutually facing two of the bases and the interconnect substrate are apart from each other. The connection bumps electrically connect the mutually facing two of the bases and the interconnect substrate together. Insulating sealing members seal the connection bumps and fill spaces between the mutually facing two of the base and the interconnect substrate. The sealing members have a cavity penetrating the sealing member.
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patent: 6121682 (2000-09-01), Kim
patent: 6522015 (2003-02-01), Glenn et al.
patent: 6717812 (2004-04-01), Pinjala et al.
patent: 6876074 (2005-04-01), Kim
Tuckerman et al; “High-Performance Heat Sinking for VLSI”; IEEE Electron Device Letters, vol. EDL-2, No. 5, pp. 126-129, (1981).
Chen et al.; “Direct Liquid Cooling of a Stacked Multichip Module”; Electronics Packing Technology Conference, pp. 380-384, (2002).
Clark S. V.
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
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