Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-02-23
1991-01-15
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156643, 156645, 1566591, 156902, 156212, 156242, 156277, 156285, 156345, 204 15, 204 384, 21912169, 427 96, 430 5, 430313, B44C 122, C03C 1500, C03C 2506, C23F 102
Patent
active
049851160
ABSTRACT:
In a process for plating or etching metalization patterns on the surface of a three dimensional substrate, a flexible plastic mask is fabricated by first coating the surface of a thin plastic sheet with vacuum formable ink. The mask is then molded into the shape of the surface into which the pattern is to be formed. A low power YAG laser is used to remove areas of the ink through which light is to be allowed to pass. This mask may then be used in either a print and plate process or a print and etch process by drawing the mask into intimate contact with the workpiece by applying a vacuum between the mask and the workpiece. The workpiece may then be exposed to light through the clear areas of the mask.
REFERENCES:
patent: 3529082 (1970-09-01), Hoesli
patent: 4029006 (1977-06-01), Mercer
patent: 4120330 (1978-10-01), Weismann
patent: 4233754 (1980-11-01), Dubuit
patent: 4414298 (1983-11-01), Krenz
patent: 4584767 (1986-04-01), Gregory
patent: 4591220 (1986-05-01), Impey
patent: 4645347 (1987-02-01), Rioux
patent: 4689103 (1987-08-01), Elarde
patent: 4692878 (1987-09-01), Ciongoli
patent: 4710419 (1987-12-01), Gregory
patent: 4749355 (1988-06-01), Hemmer
patent: 4764849 (1988-08-01), Khan
patent: 4791490 (1988-12-01), Knight et al.
IPC-MB-380 Draft Standard, Performance Specifications for Molded Printed Boards, Jan., 1987.
"Electrophoretic Photoresist Technology: An Image of the Future Today", Vidusek, EPIC Winter Conference, Dec., 1988.
"Cast Spring"-A Plated, Molded Thermoplastic Electrical I/O Interface, Jack O'Brien, Connection Technology, Jun., 1989.
MINT-PAC Technologies Inc., "Solutios to Tomorrows Electronic Packaging Needs", summer 1989 promotional literature.
Johnson William L.
Mettler John H.
Strickland William C.
Zaderej Victor V.
Miller Jerry A.
Mint-Pac Technologies, Inc.
Powell William A.
LandOfFree
Three dimensional plating or etching process and masks therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Three dimensional plating or etching process and masks therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three dimensional plating or etching process and masks therefor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-53426