Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1991-10-30
1993-12-14
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
361689, 361729, 165 804, 165185, H01L 3902, H01L 2504
Patent
active
052705714
ABSTRACT:
A three-dimensional microelectronic package for semiconductor chips includes alternating layers of wafer interconnect stacks and chip carrier modules. The wafer interconnect stacks provide electrical interconnections in the x, y, and z directions. The wafer interconnect stacks have conductive segments and interposers to provide signal path selection in the z-axis direction, and bump technology to provide high quality contacts between layers and continuity of the z-axis signal paths. Each layer of chip carrier modules includes a plurality of modules arranged in a preselected pattern. Each module comprises a chip carrier coupon which has a semiconductor chip mounted thereon, at least one annular spacer coupon provided on the carrier coupon and having an aperture aligned with the semiconductor chip and an opening which is aligned with a coolant discharge port in a coolant supply tube, and a lid. A coolant cavity is defined by the aperture in the spacer coupon(s). The carrier coupon, the annular space coupon and the lid all have vias for providing z axis signal transmission. Electrical interconnections between the vias on each coupon of the module and between the modules and the wafer interconnect stacks are provided by pressurizing bumps on the surface of each of these components. Coolant escapes from the coolant cavity of each module by flowing in the gaps, created by the bumps, between the carrier coupon and the spacer coupon and between the spacer coupon and the lid.
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Parks Howard L.
Piatt Terence D.
Amdahl Corporation
Hille Rolf
Ostrowski David
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