Three-dimensional package and method of making the same

Details Three-dimensional package and method of making the same Three-dimensional package and method of making the same

2006-12-26

2008-11-04

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S700000, C257S723000, C257S777000, C257S778000

Reexamination Certificate

active

07446404

ABSTRACT:
A three-dimensional package including a first wafer having at least one first pad and a first protection layer exposing the first pad. A first hole penetrates the first wafer. A first isolation layer is disposed on the side wall of the first hole. The lower end of a first conductive layer extends below the surface of the first wafer. A first metal is disposed in the first hole, and is electrically connected to the first pad via the first conductive layer. A first solder is disposed on the first metal in the first hole, wherein the melting point of the first solder is lower than that of the first metal. A second wafer is configured similarly as the first wafer. A lower end of a second conductive layer of the second wafer extends below the surface of the second wafer and contacts the upper end of the first solder.

REFERENCES:
patent: 3761782 (1973-09-01), Youmans
patent: 4394712 (1983-07-01), Anthony
patent: 4499655 (1985-02-01), Anthony
patent: 4807021 (1989-02-01), Okumura
patent: 4842699 (1989-06-01), Hua et al.
patent: 4897708 (1990-01-01), Clements
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 5166097 (1992-11-01), Tanielian
patent: 5191405 (1993-03-01), Tomita et al.
patent: 5229647 (1993-07-01), Gnadinger
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5241454 (1993-08-01), Ameen et al.
patent: 5266912 (1993-11-01), Kledzik
patent: 5300813 (1994-04-01), Joshi et al.
patent: 5380681 (1995-01-01), Hsu
patent: 5399898 (1995-03-01), Rostoker
patent: 5401689 (1995-03-01), Frei et al.
patent: 5404044 (1995-04-01), Booth et al.
patent: 5411918 (1995-05-01), Keible et al.
patent: 5419806 (1995-05-01), Huebner
patent: 5432999 (1995-07-01), Capps et al.
patent: 5466634 (1995-11-01), Beilstein, Jr. et al.
patent: 5481133 (1996-01-01), Hsu
patent: 5510655 (1996-04-01), Tanielian
patent: 5517057 (1996-05-01), Beilstein, Jr. et al.
patent: 5561622 (1996-10-01), Bertin et al.
patent: 5563086 (1996-10-01), Bertin et al.
patent: 5567654 (1996-10-01), Beilstein, Jr. et al.
patent: 5571754 (1996-11-01), Bertin et al.
patent: 5608264 (1997-03-01), Gaul
patent: 5618752 (1997-04-01), Gaul
patent: 5627106 (1997-05-01), Hsu
patent: 5637912 (1997-06-01), Cockerill et al.
patent: 5675180 (1997-10-01), Pedersen et al.
patent: 5682062 (1997-10-01), Gaul
patent: 5699234 (1997-12-01), Saia et al.
patent: 5767001 (1998-06-01), Bertagnolli et al.
patent: 5837566 (1998-11-01), Pedersen et al.
patent: 5872025 (1999-02-01), Cronin et al.
patent: 5891761 (1999-04-01), Vindasius et al.
patent: 5998292 (1999-12-01), Black et al.
patent: 6124149 (2000-09-01), Paik et al.
patent: 6146992 (2000-11-01), Lauterbach et al.
patent: 6168969 (2001-01-01), Farnworth
patent: 6177296 (2001-01-01), Vindasius et al.
patent: 6187677 (2001-02-01), Ahn
patent: 6221769 (2001-04-01), Dhong et al.
patent: 6228470 (2001-05-01), Kresge et al.
patent: 6313517 (2001-11-01), Lauterbach et al.
patent: 6429509 (2002-08-01), Hsuan
patent: 6451624 (2002-09-01), Farnworth et al.
patent: 6451626 (2002-09-01), Lin
patent: 6475831 (2002-11-01), Moden et al.
patent: 6566232 (2003-05-01), Hara et al.
patent: 6577013 (2003-06-01), Glenn et al.
patent: 6583030 (2003-06-01), Grassl
patent: 6642081 (2003-11-01), Patti
patent: 6645796 (2003-11-01), Christensen et al.
patent: 6645832 (2003-11-01), Kim et al.
patent: 6667551 (2003-12-01), Hanaoka et al.
patent: 6677235 (2004-01-01), Yegnashankaran et al.
patent: 6693361 (2004-02-01), Siniaguine et al.
patent: 6716737 (2004-04-01), Plas et al.
patent: 6720661 (2004-04-01), Hanaoka et al.
patent: 6723577 (2004-04-01), Geusic et al.
patent: 6727116 (2004-04-01), Poo et al.
patent: 6744127 (2004-06-01), Hedler et al.
patent: 6756681 (2004-06-01), Hanawa
patent: 6773955 (2004-08-01), Moden et al.
patent: 6774477 (2004-08-01), Han
patent: 6809421 (2004-10-01), Hayasaka et al.
patent: 6812549 (2004-11-01), Umetsu et al.
patent: 6828175 (2004-12-01), Wood et al.
patent: 6838310 (2005-01-01), Hsuan
patent: 6841849 (2005-01-01), Miyazawa
patent: 6848177 (2005-02-01), Swan et al.
patent: 6852621 (2005-02-01), Hanaoka et al.
patent: 6853085 (2005-02-01), Kux et al.
patent: 6894386 (2005-05-01), Poo et al.
patent: 6903442 (2005-06-01), Wood et al.
patent: 6908845 (2005-06-01), Swan et al.
patent: 7102219 (2006-09-01), Hanaoka et al.
patent: 2004/0245623 (2004-12-01), Hara et al.
patent: 2006/0138629 (2006-06-01), Fukazawa
patent: 2002246540 (2002-08-01), None
patent: I227910 (2005-02-01), None

Affiliated with

Also associated with

Rating

Three-dimensional package and method of making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Three-dimensional package and method of making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensional package and method of making the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4024510