Three dimensional multi-chip module with integral heat sink

Details Three dimensional multi-chip module with integral heat sink Three dimensional multi-chip module with integral heat sink

1993-07-09

1994-10-25

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257719, 361709, 361789, 439 67, H05K 720

Patent

active

053594932

ABSTRACT:
The invention is to a three dimensional circuit module constructed around a heat sink 10. A large integrated circuit component 21 such as a Micro Processing Unit for a computer is mounted over contact pads 27 on a printed wiring board 20. Also mounted to contact pads 27 on the printed wiring board are submodules 11, 12, 24, 25 that have wiring patterns interconnected to other circuit components 13-17, such as high power memory devices. The printed circuit submodules are mounted on the sides of the heat sink.

REFERENCES:
patent: 3480837 (1969-11-01), Feldmann
patent: 3518493 (1970-06-01), Bathrick, Jr.
patent: 4509098 (1985-04-01), DasGupta
patent: 4597617 (1986-07-01), Enochs
patent: 4958260 (1990-09-01), Kobayashi
patent: 5019940 (1991-05-01), Clemens
patent: 5067280 (1991-11-01), Karnezos
patent: 5276584 (1994-01-01), Collins
patent: 5278724 (1994-01-01), Angulas

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